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250K solder balls for BGA reballing kit 0.76mm leaded tin balls
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Shenzhen Fundar Technology Limited
14 yrs
CN
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Key attributes
Other attributes
Place of Origin
Guangdong, China
Brand Name
Fundar
Model Number
Solder balls
Color
White
Application
Computer/laptop/game machine etc
Volume
Sealed 250,000pcs/bottle
Usage
Bga Rework
Material for Leaded bga solder ball
63%Sn,37%Pb
Packaging and delivery
Packaging Details
Selling Units: Single item
Single gross weight:0.5 KG
Package Type:carton box
Port
Shenzhen
Supply Ability
Supply Ability
1000 Set/Sets per Month
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Shenzhen Fundar Technology Limited
14
Located in CN
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Product descriptions from the supplier
Minimum order quantity: 1 set
$5.00 - $20.00
Quantity
-
+
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Item subtotal (0 variations 0 items)
$0.00
Shipping total
$0.00
Subtotal
$0.00
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